Modeling of interconnects and electromagnetic field distributions using FDTD method

被引：0
|
作者：
Watanabe, T [1 ]
Suzuki, M [1 ]
Kamo, A [1 ]
Asai, H [1 ]
机构：
[1] Univ Shizouka, Sch Adm & Informat, Shizuoka 4228526, Japan
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2001年
关键词：
D O I：
10.1109/EPEP.2001.967638
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper describes an efficient technique for synthesizing macromodels of interconnects and electromagnetic emissions on PCB. This technique enables to rapidly extract the characteristics of interconnects using FDTD method and its Absolute Boundary Conditions. Once making the macromodels, electromagnetic distributions are rapidly analyzed by conventional circuit simulators.
引用
收藏
页码：169 / 172
页数：4
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