Plastics - the future of electronics in packaging?

被引：0
作者：
Butler, M [1 ]
机构：
[1] Univ Sheffield, Ctr Polymer, Sheffield S3 7HF, S Yorkshire, England
来源：
MATERIALS WORLD | 2006年 / 14卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
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页码：22 / 23
页数：2
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