Plastics - the future of electronics in packaging?

被引：0
作者：
Butler, M [1 ]
机构：
[1] Univ Sheffield, Ctr Polymer, Sheffield S3 7HF, S Yorkshire, England
来源：
MATERIALS WORLD | 2006年 / 14卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：22 / 23
页数：2
相关论文
共 50 条
[21]   PLASTICS IN PACKAGING [J].
不详 .
APPLIED PLASTICS AND REINFORCED PLASTICS REVIEW, 1969, 12 (05) :18-&
[22]   Plastics in packaging [J].
Thomas, Ralph H. Sr. .
Polymer News, 1994, 19 (02)
[23]   Plastics packaging [J].
Stewart, R .
PLASTICS ENGINEERING, 2005, 61 (02) :20-+
[24]   PLASTICS FOR PACKAGING [J].
不详 .
ALIMENTA, 1990, 29 (04) :75-78
[25]   PACKAGING WITH PLASTICS [J].
GOLDENBERG, N .
CHEMISTRY & INDUSTRY, 1976, (05) :207-208
[26]   Plastics in packaging [J].
Thomas, Ralph H. Sr. .
2000, Gordon Breach Sci Publ Inc, Reading, Engl (25)
[27]   PACKAGING IS PLASTICS [J].
不详 .
EUROPLASTICS MONTHLY, 1973, 46 (01) :78-79
[28]   PLASTICS IN PACKAGING [J].
COWARD, CT .
CHEMISTRY IN BRITAIN, 1970, 6 (06) :259-&
[29]   PLASTICS IN PACKAGING [J].
BRISTON, JH .
MANUFACTURING CHEMIST AND AEROSOL NEWS, 1971, 42 (03) :33-&
[30]   Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging [J].
Kim, Jae Choon ;
Ren, Zongqing ;
Yuksel, Anil ;
Dede, Ercan M. ;
Bandaru, Prabhakar R. ;
Oh, Dan ;
Lee, Jaeho .
JOURNAL OF ELECTRONIC PACKAGING, 2021, 143 (01)
12345