An Ultra-Thin Piezoresistive Stress Sensor for Measurement of Tooth Orthodontic Force in Invisible Aligners

被引:26
|
作者
Shi, Yun [1 ]
Ren, Chaochao [2 ]
Hao, Wei [2 ]
Zhang, Min [1 ]
Bai, Yuxing [2 ]
Wang, Zheyao [1 ]
机构
[1] Tsinghua Univ, Inst Microelect, Beijing 100084, Peoples R China
[2] Beijing Stomatol Hosp, Dept Othodont, Beijing 100050, Peoples R China
关键词
Orthodontic force; piezoresistive; stress sensor; ultra-thin; ROOT RESORPTION; INVISALIGN; SYSTEMS;
D O I
10.1109/JSEN.2011.2166065
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A silicon piezoresistive stress sensor is developed to measure the three components of the orthodontic forces of a tooth in invisible aligners. The stress sensor chip consists of multiple piezoresistor rosettes, and is fixed on the tooth surface to measure the orthodontic force induced stresses. An inverse problem algorithm is established to reconstruct the orthodontic forces of the tooth from the measured stresses. A key thinning process is developed using chemical-mechanical polishing to thin the sensor chip from 650 to 100, such that it can be accommodated to the limited space between the aligner and the tooth, without much influence on the orthodontic force. The ultra-thin thickness enables the sensor chip to be compliance with tooth deformation, and improves the stress measurement sensitivity as much as 40 times, making it capable of measuring small orthodontic force. The sensor design, fabrication, orthodontic stress measurement, and force reconstruction are given in details, and the experimental results demonstrate the feasibility of using miniaturized and ultrathin sensors to determine the in vitro orthodontic forces.
引用
收藏
页码:1090 / 1097
页数:8
相关论文
共 50 条
  • [11] A Highly Flexible, Stretchable and Ultra-thin Piezoresistive Tactile Sensor Array using PAM/PEDOT:PSS Hydrogel
    Phi Tien Hoang
    Hoa Phung
    Canh Toan Nguyen
    Tien Dat Nguyen
    Choi, Hyouk Ryeol
    2017 14TH INTERNATIONAL CONFERENCE ON UBIQUITOUS ROBOTS AND AMBIENT INTELLIGENCE (URAI), 2017, : 950 - 955
  • [12] Ultra-Thin Fiber-Tip Micro-Bubble Sensor for Pressure Measurement
    Liu, Xinglin
    Wang, Guanjun
    Wang, Zhibin
    Gu, Jinyu
    Luo, Xinwei
    2017 CONFERENCE ON LASERS AND ELECTRO-OPTICS PACIFIC RIM (CLEO-PR), 2017,
  • [13] Ultra-Thin Veneers Without Tooth Preparation in Extensive Oligodontia
    Savi, Andrea
    Crescini, Aldo
    Tinti, Carlo
    Manfredi, Maddalena
    INTERNATIONAL JOURNAL OF PERIODONTICS & RESTORATIVE DENTISTRY, 2015, 35 (06) : E97 - E103
  • [14] Ultra-Thin Multi-Axial Shear Stress Sensor Based on a Segmented Photodiode
    Missinne, Jeroen
    Kostov, Plamen
    Van Hoe, Bram
    Bosman, Erwin
    Gaberl, Wolfgang
    Zimmermann, Horst
    Van Steenberge, Geert
    2013 IEEE PHOTONICS CONFERENCE (IPC), 2013, : 606 - 607
  • [15] Fabrication of ultra-thin silicon stress sensor chips with high flexibility and high sensitivity
    Zhao, Pai
    Deng, Ning
    Wang, Zheyao
    2014 IEEE SENSORS, 2014,
  • [16] Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultra Thin Device
    Zhang, Xiaowu
    Rajoo, Ranjan
    Selvanayagam, Cheryl S.
    Kumar, Aditya
    Rao, Vempati Srinivasa
    Khan, Navas
    Kripesh, V.
    Lau, John H.
    Kwong, D. -L.
    Sundaram, V.
    Tummula, Rao R.
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1276 - 1282
  • [17] Measurement and modeling of the annealing kinetics of stress induced leakage current in ultra-thin oxides
    Riess, P
    Ghibaudo, G
    Pananakakis, G
    Brini, J
    MICROELECTRONICS RELIABILITY, 1999, 39 (02) : 203 - 207
  • [18] Ultra-thin Image Sensor Chip Embeded Foil
    Wang, S.
    Albrecht, B.
    Harendt, C.
    Spuentrup, J. D. Schulze
    Burghartz, J. N.
    PROCEEDINGS OF THE 2021 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (FLEPS), 2021,
  • [19] The flexible package and applications of ultra-thin sensor chip
    Yang, Shujie
    Zhao, Pai
    Song, Zhen
    Wang, Zheyao
    2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [20] Magnetic Property Measurement of Ultra-Thin Silicon Steel With an Improved B-H Sensor
    Zhou, Jiapeng
    Li, Yongjian
    Dou, Yu
    Yue, Shuaichao
    Li, Zilong
    IEEE TRANSACTIONS ON MAGNETICS, 2024, 60 (09) : 1 - 1