Towards 3D optical integration by micro-transfer printing of ultra-thin membrane devices

被引:0
|
作者
McPhillimy, John [1 ]
Klitis, Charalambos [2 ]
Hill, Paul [1 ]
May, Stuart [2 ]
Guilhabert, Benoit [1 ]
Dawson, Martin D. [1 ]
Sorel, Marc [2 ]
Strain, Michael J. [1 ]
机构
[1] Univ Strathclyde, Dept Phys, Inst Photon, Glasgow, Lanark, Scotland
[2] Univ Glasgow, Sch Engn, Glasgow, Lanark, Scotland
来源
2018 IEEE BRITISH AND IRISH CONFERENCE ON OPTICS AND PHOTONICS (BICOP) | 2018年
基金
英国工程与自然科学研究理事会;
关键词
Photonic integrated circuits; hybrid integration; transfer printing; silicon photonics; diamond; III-V semiconductors;
D O I
暂无
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Transfer printing is a micro-assembly technique that has been used to demonstrate hybrid material device integration using membranes, typically of a few microns in thickness. In order to target full 3D integration of integrated photonic devices, here we present the fabrication and printing of membranes with dimensions down to 10's of nanometres. Both sacrificial layer etching and assembly of free standing platelets onto support substrates have been developed to allow membrane formation across a range of material platforms. Devices are successfully printed onto host substrates, showing a high degree of mechanical flexibility and conformation over existing surface features. Multi-layer printing of membranes shows a route towards micro-assembly of hybrid material 3D photonics.
引用
收藏
页码:124 / 127
页数:4
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