共 50 条
- [1] 3D integration of ultra-thin functional devices inside standard multilayer flex laminates 2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 671 - 675
- [2] Novel IR Laser Cleaving for ultra-thin Layer Transfer and 3D Stacked Devices 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1749 - 1753
- [4] Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1789 - 1795
- [5] A new ultra-thin 3D integration technique: Technological and thermal investigations DESIGN, TEST, INTEGRATION, AND PACKAGING OF MEMS/MOEMS, PROCEEDINGS, 2000, 4019 : 324 - 332
- [6] Patterned InterVia for Heterogeneous Integration of III-V devices onto silicon photonics by using micro-Transfer Printing 2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC, 2023,
- [7] PZT thin-film actuator driven micro optical scanning sensor by 3D integration of optical and mechanical devices MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 1999, : 435 - 440
- [9] Centimetre-scale micro-transfer printing to enable heterogeneous integration of thin film lithium niobate with silicon photonics OPTICAL MATERIALS EXPRESS, 2025, 15 (03): : 531 - 540
- [10] 3D laser printing by ultra-short laser pulses for micro-optical applications: towards telecom wavelengths PACIFIC RIM LASER DAMAGE 2017-OPTICAL MATERIALS FOR HIGH-POWER LASERS, 2017, 10339