Insertion of EUVL into high volume manufacturing

被引：19

作者：

Silverman, PJ ^{[1
]}

机构：

[1] Intel Corp, Santa Clara, CA 95051 USA

来源：

EMERGING LITHOGRAPHIC TECHNOLOGIES V | 2001年 / 4343卷

关键词：

EUV lithography; EUVL; manufacturing; cost;

D O I：

10.1117/12.436631

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

EUV Lithography has become the leading and perhaps only, candidate for extension of semiconductor lithography into the sub-50nm realm. This paper reviews the requirements for high volume, semiconductor lithography and examines the capability of EUVL to meet those challenges. The current state of EUVL technology is reviewed and the remaining challenges for insertion of EUVL into manufacturing are discussed.

引用

页码：12 / 18

页数：7