Energy-rate consideration in wafer bonding

被引:2
作者
Fan, H
Xu, JG
Sze, KY [1 ]
机构
[1] Univ Hong Kong, Dept Mech Engn, Hong Kong, Hong Kong, Peoples R China
[2] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore
关键词
wafer bonding; contact mechanics; energy rate; finite element analysis;
D O I
10.1016/j.finel.2005.10.003
中图分类号
O29 [应用数学];
学科分类号
070104 ;
摘要
In the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which "rate" refers to "area rate". A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:709 / 714
页数:6
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