Reflow profile study of the Sn-Ag-Cu solder

被引：47

作者：

Salam, B ^{[1
]}

Virseda, C ^{[1
]}

Da, H ^{[1
]}

Ekere, NN ^{[1
]}

Durairaj, R ^{[1
]}

机构：

[1] Univ Greenwich, Sch Engn, Greenwich, Kent, England

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2004年 / 16卷 / 01期

关键词：

soldering; surface texture; surface treatment;

D O I：

10.1108/09540910410517022

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-AgCu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230degreesC. The recommended time above liquidus is 40 s for the RSS reflow profile and 50-70s for the RTS reflow profile.

引用

页码：27 / 34

页数：8

共 11 条

[1]

FREAR DR, 1991, TMS MINERALS METALS, P29

[2]

HWANG JS, 2001, ENV FRIENDLY ELECT L, P464

[3] Optimizing the reflow profile via defect mechanism analysis [J].

Lee, NC .

SOLDERING & SURFACE MOUNT TECHNOLOGY, 1999, 11 (01) :13-20

[4] Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys [J].

Moon, KW ;

Boettinger, WJ ;

Kattner, UR ;

Biancaniello, FS ;

Handwerker, CA .

JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) :1122-1136

[5]

OTT L, 1988, INTRO STAT METHODS D, P131

[6]

PRASAD RP, 1989, SURFACE MOUNT TECHNO, P447

[7]

SKIDMORE T, 2000, CIRCUITS ASSEMBLY, P17

[8]

SUGANUNA H, 2001, SMT MAGAZINE, P65

[9]

SURASKI D, 2000, SMT MAGAZINE, P64

[10]

WICKHAM M, 2001, MATCA050 NPL

← 1 2 →