A Note on the Reliability of Cu/Au Wire Interconnects

被引：0
作者：
Lau, J. [1 ]
Wu, S. [1 ]
Lau, J. M. [2 ]
机构：
[1] Ind Technol Res Inst, Elect & Optoelect Lab, Hsinchu, Taiwan
[2] Stanford Univ, Dept Phys, Stanford, CA 94305 USA
来源：
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 | 2012年
关键词：
COPPER WIRE; BONDING WIRE; BALL; AL; GOLD; INTERMETALLICS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for determining the internal forces and deformations of wires when subjected to an external pull force, (2) the determination of the maximum pull force (when the wire breaks) based on some failure criteria of the wires; and (3) the experimental verification of the present equations.
引用
收藏
页码：83 / +
页数：4
相关论文
共 47 条
[1]  
[Anonymous], P JPN INT EL MAN TEC
[2]   Fine Pitch Copper Wire Bonding - Why Now? [J].
Appelt, Bernd K. ;
Tseng, Andy ;
Lai, Yi-Shao .
2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, :469-+
[3]   On the Intermetallic Corrosion of Cu-Al wire bonds [J].
Boettcher, Tim ;
Rother, Michael ;
Liedtke, Stefan ;
Ullrich, Mandy ;
Bollmann, Marc ;
Pinkernelle, Andreas ;
Gruber, Daniel ;
Funke, Hans-Juergen ;
Kaiser, Michael ;
Lee, Kan ;
Li, Martin ;
Leung, Karina ;
Li, Tina ;
Farrugia, Mark Luke ;
O'Halloran, Orla ;
Petzold, Matthias ;
Marz, Benjamin ;
Klengel, Robert .
2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, :585-590
[4]   Effects of Moisture on Reliability of Gold and Copper Ball Bonds [J].
Breach, C. D. ;
Shen, Ng Hun ;
Mun, Tee Wai ;
Lee, Teck Kheng ;
Holliday, R. .
2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, :44-51
[5]   Developments in Fine Pitch Copper Wire Bonding Production [J].
Chylak, Bob .
2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, :1-6
[6]  
Deley M., 2005, P SEM SING 2005 SING
[7]  
England L, 2007, ELEC COMP C, P1604
[8]   Bonding wire characterization using automatic deformability measurement [J].
Hang, C. J. ;
Lum, I. ;
Lee, J. ;
Mayer, M. ;
Wang, C. Q. ;
Zhou, Y. ;
Hong, S. J. ;
Lee, S. M. .
MICROELECTRONIC ENGINEERING, 2008, 85 (08) :1795-1803
[9]   Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging [J].
Hang, C. J. ;
Wang, C. Q. ;
Mayer, M. ;
Tian, Y. H. ;
Zhou, Y. ;
Wang, H. H. .
MICROELECTRONICS RELIABILITY, 2008, 48 (03) :416-424
[10]  
Harman G.G., 2010, Wire Bonding in Microelectronics
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