Millimeter-Wave Horn-Type Antenna-in-Package Solution Fabricated in a Teflon-Based Multilayer PCB Technology

被引：34
作者：
Enayati, Amin [1 ,2 ]
Vandenbosch, Guy A. E. [2 ]
De Raedt, Walter [3 ]
机构：
[1] Katholieke Univ Leuven, Interuniv Microelect Ctr IMEC, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, Elect Engn Dept ESAT, B-3001 Louvain, Belgium
[3] Interuniv Microelect Ctr IMEC, B-3001 Louvain, Belgium
来源：
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION | 2013年 / 61卷 / 04期
关键词：
Antenna-in-package solution; embedded horn; millimeter-wave transceivers; multi-layer PCB technology; ON-CHIP; WIRELESS COMMUNICATIONS; CMOS; SYSTEMS; GUIDE; ARRAY;
D O I：
10.1109/TAP.2013.2242827
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An antenna-in-package solution is introduced for millimeter-wave applications. The solution is implemented in an asymmetric PCB technology incorporating 4 laminates of a Teflon-based and one laminate of a Ceramic-based material. A Horn-like element embedded in the PCB technology is designed and manufactured. The simulated and measured return losses are better than 10 dB in the frequency band 55-68 GHz, which makes the element suitable to be used for 60 GHz multi-Gb/Sec applications. The antenna element also provides 6 dB of gain with a ripple less that 0.5 dB from 53 GHz to 60 GHz. Moreover, 3 different arrays have been designed using the same Horn-like antenna as the radiating element. The simulated and measured radiation characteristics of all the antennas are investigated at different frequencies. It is shown that the antenna element is capable of being arrayed for applications where non-line-of-sight communication is needed or multi-path spatial diversity techniques are to be implemented.
引用
收藏
页码：1581 / 1590
页数：10
相关论文
共 31 条
[1]   Balanced-Fed Planar Antenna for Millimeter-Wave Transceivers [J].
Akkermans, Johannes A. G. ;
Herben, Matti H. A. J. ;
van Beurden, Martijn C. .
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2009, 57 (10) :2871-2881
[2]   High-Efficiency Angled-Dipole Antennas for Millimeter-Wave Phased Array Applications [J].
Alhalabi, Ramadan A. ;
Rebeiz, Gabriel M. .
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2008, 56 (10) :3136-3142
[3]   94-GHz Log-Periodic Antenna on GaAs Substrate Using Air-Bridge Structure [J].
Baek, Yong-Hyun ;
Truong, Le Huu ;
Park, Sun-Woo ;
Lee, Sang-Jin ;
Chae, Yeon-Sik ;
Rhee, Eung-Ho ;
Park, Hyun-Chang ;
Rhee, Jin-Koo .
IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2009, 8 :909-911
[4]   Modified Compact Antipodal Vivaldi Antenna for 4-50-GHz UWB Application [J].
Bai, Jian ;
Shi, Shouyuan ;
Prather, Dennis W. .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2011, 59 (04) :1051-1057
[5]   Optimized Microstrip Antenna Arrays for Emerging Millimeter-Wave Wireless Applications [J].
Biglarbegian, Behzad ;
Fakharzadeh, Mohammad ;
Busuioc, Dan ;
Nezhad-Ahmadi, Mohammad-Reza ;
Safavi-Naeini, Safieddin .
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2011, 59 (05) :1742-1747
[6]   V-Band On-Chip Dipole-Based Antenna [J].
Chen, I-Shan ;
Chiou, Hwann-Kaeo ;
Chen, Nan-Wei .
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2009, 57 (10) :2853-2861
[7]  
CHUANG H, 2011, IEEE T ELECTRON DEV, V58, P2583
[8]   Vertical via-less transition in MCM technology for millimetre-wave applications [J].
Enayati, A. ;
Brebels, S. ;
Deraedt, W. ;
Vandenbosch, G. A. E. .
ELECTRONICS LETTERS, 2010, 46 (04) :287-U39
[9]   3D-Antenna-in-Package Solution for Microwave Wireless Sensor Network Nodes [J].
Enayati, Amin ;
Brebels, Steven ;
De Raedt, Walter ;
Vandenbosch, Guy A. E. .
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2011, 59 (10) :3617-3623
[10]   On-Chip Integrated Antenna Structures in CMOS for 60 GHz WPAN Systems [J].
Gutierrez, Felix, Jr. ;
Agarwal, Shatam ;
Parrish, Kristen ;
Rappaport, Theodore S. .
IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS, 2009, 27 (08) :1367-1378
1234