Characteristics of Slurry Recycling in Chemical Mechanical Polishing (CMP) of Fused Silica (FS)

被引：3
|
作者：
Zhou, Yan [1 ,2 ,3 ]
Luo, Haimei [1 ,2 ,3 ]
Luo, Guihai [1 ,2 ,3 ]
Kang, Chengxi [1 ]
Chen, Gaopan [1 ,2 ,3 ]
Pan, Guoshun [1 ,2 ,3 ]
机构：
[1] Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China
[2] Guangdong Prov Key Lab Optomechatron, Shenzhen 518057, Peoples R China
[3] Tsinghua Univ Shenzhen, Res Inst, Shenzhen Key Lab Micro Nano Mfg, Shenzhen 518057, Peoples R China
来源：
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | 2019年 / 8卷 / 03期
基金：
中国国家自然科学基金;
关键词：
SURFACE; DAMAGE;
D O I：
10.1149/2.0121903jss
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Fused silica (FS) has attracted much attention and is widely applied in astronomical telescopes, laser systems, semicouductor industry, and optical communication. Based on the ultra-smooth surface polishing of fused silica using silica slurry, the variations of polishing performance of fused silica in the recycling polishing were studied. Meanwhile, the variations of slurry characteristics in chemical mechanical polishing (CMP) of fused silica were investigated. The variations of the average size and the morphology of the abrasive silica particles were observed. And the change of pH value and the conductivity of the slurry were monitored. The thermal gravimetric analysis (TGA) was used to evaluate the chemical change of the abrasive silica particles. Then, elastic moduli via atomic force microscope (AFM) force curves measurement of the abrasive particles were measured and analyzed. In addition, the relative removal mechanism of fused silica was discussed. (C) 2019 The Electrochemical Society.
引用
收藏
页码：P196 / P201
页数：6
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