Thermal and mechanical properties of tetra-functional mesogenic type epoxy resin cured with aromatic amine

被引:35
作者
Harada, Miyuki [1 ]
Morioka, Daichi [1 ]
Ochi, Mitsukazu [1 ]
机构
[1] Kansai Univ, Fac Chem Mat & Bioengn, Suita, Osaka 5648680, Japan
关键词
mechanical properties; resins; thermal properties; thermosets; THERMOMECHANICAL PROPERTIES; EPOXY/SILICA HYBRIDS; NAPHTHALENE MOIETY; NETWORK STRUCTURE; PHASE-STRUCTURE; PHENOL NOVOLAC; POLYMER;
D O I
10.1002/app.46181
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
A novel tetra-functional epoxy monomer with mesogenic groups was synthesized and characterized by H-1-NMR and FTIR. The synthesized epoxy monomer was cured with aromatic amine to improve the thermal property of epoxy/amine cured system. The glass transition temperature (T-g) and coefficient of thermal expansion (CTE) of the cured system were investigated by dynamic mechanical analysis and thermal mechanical analysis. The properties of the cured system were compared with the conventional bisphenol-A type epoxy and mesogenic type epoxy system. The storage modulus of the tetra-functional mesogenic epoxy cured systems showed the value of 0.96 GPa at 250 degrees C, and T-g-less behavior was clearly observed. The cured system also showed a low CTE at temperatures above 150 degrees C without incorporation of inorganic components. These phenomena were achieved by suppression of the thermal motion of network chains by introduction of both mesogenic groups and branched structure to increase the cross linking density. The temperature dependency of the tensile property and thermal conductivity of the cured system was also investigated. (c) 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46181.
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页数:7
相关论文
共 30 条
[11]  
2-X
[12]   Low k epoxy resin containing cycloaliphatic hydrocarbon with high crosslinking density [J].
Kong, Lingqiang ;
Cheng, Yuanrong ;
Jin, Yunxia ;
Qi, Tianke ;
Xiao, Fei .
JOURNAL OF APPLIED POLYMER SCIENCE, 2016, 133 (21)
[13]   Synthesis, characterization, and thermomechanical properties of liquid crystalline epoxy resin containing ketone mesogen [J].
Lin, Yi-Sheng ;
Hsu, Steve Lien-Chung ;
Ho, Tsung-Han ;
Cheng, Shi-Shiun ;
Hsiao, Yu-Hsiang .
POLYMER ENGINEERING AND SCIENCE, 2017, 57 (04) :424-431
[14]   Nitrogen-Free Tetrafunctional Epoxy and Its DDS-Cured High-Performance Matrix for Aerospace Applications [J].
Liu, Tuan ;
Zhang, Liangdong ;
Chen, Ruoshi ;
Wang, Liwei ;
Han, Bing ;
Meng, Yan ;
Li, Xiaoyu .
INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 2017, 56 (27) :7708-7719
[15]   New epoxy/silica-titania hybrid materials prepared by the sol-gel process [J].
Lu, Shaorong ;
Zhang, Hailiang ;
Zhao, Caixian ;
Wang, Xiayu .
JOURNAL OF APPLIED POLYMER SCIENCE, 2006, 101 (02) :1075-1081
[16]   Current SiC technology for power electronic devices beyond Si [J].
Matsunami, H .
MICROELECTRONIC ENGINEERING, 2006, 83 (01) :2-4
[17]   High-temperature electronics - A role for wide bandgap semiconductors? [J].
Neudeck, PG ;
Okojie, RS ;
Chen, LY .
PROCEEDINGS OF THE IEEE, 2002, 90 (06) :1065-1076
[18]   Phase structure and mechanical and adhesion properties of epoxy/silica hybrids [J].
Ochi, M ;
Takahashi, R ;
Terauchi, A .
POLYMER, 2001, 42 (12) :5151-5158
[19]  
Ochi M, 1997, J POLYM SCI POL PHYS, V35, P397, DOI 10.1002/(SICI)1099-0488(19970130)35:2<397::AID-POLB15>3.0.CO
[20]  
2-D