A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers

被引：19

作者：

Goethals, Frederik ^{[1
]}

Baklanov, Mikhail R. ^{[2
]}

Ciofi, Ivan ^{[2
]}

Detavernier, Christophe ^{[3
]}

Van Der Voort, Pascal ^{[1
]}

Van Driessche, Isabel ^{[1
]}

机构：

[1] Univ Ghent, Dept Inorgan & Phys Chem, B-9000 Ghent, Belgium

[2] IMEC, B-3001 Louvain, Belgium

[3] Univ Ghent, Dept Solid States Sci, B-9000 Ghent, Belgium

来源：

CHEMICAL COMMUNICATIONS | 2012年 / 48卷 / 22期

关键词：

SILICA; DIELECTRICS; HYBRID; LAYER;

D O I：

10.1039/c2cc18017k

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

A new strategy to seal mesoporous low-k thin films with a pore size of 3 nm has been developed. This is achieved by spin-coating of a self-assembled carbon-bridged organosilica layer followed by a grafting with hexamethyl disilazane.

引用

页码：2797 / 2799

页数：3

共 20 条

[1] Sealing ultralow κ porous dielectrics with thin boron carbonitride films
Ahearn, W. J.
Fitzpatrick, P. R.
Ekerdt, J. G.
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2007, 25 (03): : 570 - 574
[2] Determination of pore size distribution in thin films by ellipsometric porosimetry
Baklanov, MR
Mogilnikov, KP
Polovinkin, VG
Dultsev, FN
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (03): : 1385 - 1391
[3] Baklanov MR, 2004, MATER RES SOC SYMP P, V812, P55
[4] Sealing porous low-k dielectrics with silica
de Rouffignac, P
Li, ZW
Gordon, RG
[J]. ELECTROCHEMICAL AND SOLID STATE LETTERS, 2004, 7 (12) : G306 - G308
[5] Materials chemistry for low-k materials
Hatton, Benjamin D.
Landskron, Kai
Hunks, William J.
Bennett, Mark R.
Shukaris, Donna
Perovic, Douglas D.
Ozin, Geoffrey A.
[J]. MATERIALS TODAY, 2006, 9 (03) : 22 - 31
[6] Silica-based mesoporous organic-inorganic hybrid materials
Hoffmann, Frank
Cornelius, Maximilian
Morell, Jurgen
Froeba, Michael
[J]. ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2006, 45 (20) : 3216 - 3251
[7] Nanometer-thick conformal pore sealing of self-assembled mesoporous silica by plasma-assisted atomic layer deposition
Jiang, Ying-Bing
Liu, Nanguo
Gerung, Henry
Cecchi, Joseph L.
Brinker, C. Jeffrey
[J]. JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2006, 128 (34) : 11018 - 11019
[8] Dielectric barriers, pore sealing, and metallization
Juneja, JS
Wang, PI
Karabacak, T
Lu, TM
[J]. THIN SOLID FILMS, 2006, 504 (1-2) : 239 - 242
[9] Thermally induced transition between open and closed spherical pores in ordered mesoporous silicas
Kruk, Michal
Hui, Chin Ming
[J]. JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2008, 130 (05) : 1528 - +
[10] Periodic mesoporous organosilicas containing interconnected [Si(CH2)]3 rings
Landskron, K
Hatton, BD
Perovic, DD
Ozin, GA
[J]. SCIENCE, 2003, 302 (5643) : 266 - 269

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