Upscaling plasma deposition: The influence of technological parameters

被引：17
作者：
Corbella, Carles [1 ]
机构：
[1] Fraunhofer Inst Schicht & Oberflachentech, D-38108 Braunschweig, Germany
来源：
SURFACE & COATINGS TECHNOLOGY | 2014年 / 242卷
关键词：
Upscaling; Cold plasmas; Technological parameters; CHEMICAL-VAPOR-DEPOSITION; MACROSCOPIC KINETICS; CARBON-FILMS; LARGE-AREA; GLOW-DISCHARGE; COATINGS; POLYMERIZATION; PERSPECTIVE; PRESSURE; REACTOR;
D O I：
10.1016/j.surfcoat.2013.12.002
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The technological parameters that control plasma processes follow several scaling rules. Hence, we must adapt inlet gas flow rate, pressure, input power and excitation frequency to the new reactor dimensions. High rates of film deposition or etching; plasma homogeneity, and reproducibility are the main objectives in any attempt to upscaling. This paper provides guidelines to transfer plasma deposition processes from small pilot reactors to large plants for industrial production. (C) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码：237 / 245
页数：9
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