Fault Detection and Visualization through Micron-Resolution X-ray Imaging

被引：0
|
作者：
Cicchiani, John A. [1 ]
Hartmuller, Tricia L. [1 ]
Sell, Chris M. [1 ]
Wright, R. Glenn [1 ]
机构：
[1] GMA Ind Inc, Annapolis, MD 21401 USA
来源：
2008 IEEE AUTOTESTCON, VOLS 1 AND 2 | 2008年
关键词：
X-ray; non-destructive testing; circuit test; PCB test; automatic defect recognition;
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper describes a novel, non-intrusive method for the detection of faults within printed circuit boards (PCBs) and their components using digital imaging and image analysis techniques. High-resolution X-ray imaging systems provide a means to detect and analyze failures and degradations down to micron-levels both within the PCB itself and the components that populate the board. Further, software tools can aid in the analysis of circuit features to determine whether a failure has occurred, and to obtain positive visual confirmation that a failure has occurred Many PCB and component failures previously undetectable through today's test methodologies are now detectable using this approach.
引用
收藏
页码：365 / 370
页数：6
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