Fault Detection and Visualization through Micron-Resolution X-ray Imaging

This paper describes a novel, non-intrusive method for the detection of faults within printed circuit boards (PCBs) and their components using digital imaging and image analysis techniques. High-resolution X-ray imaging systems provide a means to detect and analyze failures and degradations down to micron-levels both within the PCB itself and the components that populate the board. Further, software tools can aid in the analysis of circuit features to determine whether a failure has occurred, and to obtain positive visual confirmation that a failure has occurred Many PCB and component failures previously undetectable through today's test methodologies are now detectable using this approach.