Controlling Al/Cu composite diffusion layer during hydrostatic extrusion by using colloidal Ag

被引：45

作者：

Lee, T. H. ^{[1
]}

Lee, Y. J. ^{[2
]}

Park, K. T. ^{[2
]}

Nersisyan, H. H. ^{[3
]}

Jeong, H. G. ^{[4
]}

Lee, J. H. ^{[1
,2
]}

机构：

[1] Dept Adv Mat Engn, Grad Sch, Seoul, South Korea

[2] Green Energy Technol, Grad Sch, Ulsan, South Korea

[3] Chungnam Natl Univ, Rapidly Solidified Mat Res Ctr, Taejon 305764, South Korea

[4] KITECH, Inchon 406130, South Korea

来源：

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2013年 / 213卷 / 03期

关键词：

Hydrostatic extrusion; Diffusion bonding; Thickness of diffusion layer; Regression equation; Interface hardness; ALLOY; METAL;

D O I：

10.1016/j.jmatprotec.2012.10.001

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, intermetallic compound formation at the interface between aluminum and copper during hydrostatic extrusion was simulated by performing a solid state diffusion bonding experiment with various processing parameters, including bonding temperature and pressure and holding time, and by inserting an Ag colloid layer between the aluminum and copper. Regression equations were developed to predict thickness of diffusion layer and interface hardness. An intermetallic compound formed at the interface between the Al and Cu during diffusion bonding at 420 degrees C and 240 MPa for 60 min, and it was effectively controlled by inserting an Ag colloid. These experimental data will be useful for setting up processing parameters to prepare Al/Cu matrix composite materials by using hydrostatic extrusion. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：487 / 494

页数：8

共 15 条

[1] Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process [J].