Atomistic investigation on the effect of temperature on mechanical properties of diffusion-welded Aluminium-Nickel

被引:2
作者
Zaenudin, M. [1 ]
Mohammed, M. N. [2 ]
Al-Zubaidi, S. [3 ]
机构
[1] Inst Teknol & Kesehatan Jakarta, Dept Mech Engn, Fac Engn & Comp Sci, Raya Jatiwaringin St 278, City Of Bekasi 17411, West Java, Indonesia
[2] Management & Sci Univ, Fac Informat Sci & Engn, Dept Engn & Technol, Univ Dr, Shah Alam 40100, Selangor, Malaysia
[3] Univ Baghdad, Al Khwarizmi Coll Engn, Dept Automated Mfg Engn, Baghdad 10071, Iraq
来源
INTERNATIONAL JOURNAL OF INTEGRATED ENGINEERING | 2020年 / 12卷 / 05期
关键词
Molecular Dynamics Simulation; diffusion welding; effect of temperature; Aluminium-Nickel; Mechanical Properties; MOLECULAR-DYNAMICS; SIMULATION; INTERFACE; BEHAVIOR;
D O I
10.30880/ijie.2020.12.05.008
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Atomistic investigation of diffusion welding between Aluminium and Nickel has been investigated, by means of Molecular Dynamics (MD) simulation. This study focuses on examining the effect of temperature on diffusion welding between Al-Ni for which it is still lacking. Employing several different temperatures, this study aims to examines the influence of temperature on the mechanical properties of diffusion-welded Al-Ni. The results have shown that the structural evolution significantly affected by the temperature. Better bonding structure is achieved as the temperature is increased which indicated by the wider interfacial region thickness on concentration profiles. However, as the temperature is increased lower ultimate tensile strength is obtained. Therefore, precisely estimates the temperature for particular materials in diffusion welding is a critical point. In this study, the optimum condition that fit on the diffusion welding process is when the temperature set on 500 K.
引用
收藏
页码:62 / 70
页数:9
相关论文
共 35 条
[1]  
Abdul Razaq Mohammed N., 2019, Solid State Phenomena, V285, P115, DOI 10.4028/www.scientific.net/SSP.285.115
[2]  
American Welding Society, 2002, WELD REL EXP PROD ME
[3]   Molecular dynamics modeling of diffusion bonding [J].
Chen, SD ;
Soh, AK ;
Ke, FJ .
SCRIPTA MATERIALIA, 2005, 52 (11) :1135-1140
[4]   Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al [J].
Chen, Shangda ;
Ke, Fujiu ;
Zhou, Min ;
Bai, Yilong .
ACTA MATERIALIA, 2007, 55 (09) :3169-3175
[5]   Atomic diffusion across Ni50Ti50-Cu explosive welding interface: Diffusion layer thickness and atomic concentration distribution [J].
Chen Shi-Yang ;
Wu Zhen-Wei ;
Liu Kai-Xin .
CHINESE PHYSICS B, 2014, 23 (06)
[6]   Effects of high energy Au-ion irradiation on the microstructure of diamond films [J].
Chen, Shih-Show ;
Chen, Huang-Chin ;
Wang, Wei-Cheng ;
Lee, Chi-Young ;
Lin, I-Nan ;
Guo, Jinghua ;
Chang, Ching-Lin .
JOURNAL OF APPLIED PHYSICS, 2013, 113 (11)
[7]  
Darolia R, 1996, SUPERALLOYS 1996, P561
[8]  
Dmitriev A. I., 2014, P 42 INT SUMM SCH AP, P10
[9]   Molecular dynamics simulation of tensile behavior of diffusion bonded Ni/Al nanowires [J].
Hu, Zhenjiang ;
Zhang, Junjie ;
Yan, Yongda ;
Yan, Jiuchun ;
Sun, Tao .
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2013, 27 (01) :43-46
[10]   Nanostructures generated by explosively driven friction: Experiments and molecular dynamics simulations [J].
Kim, H-J. ;
Emge, A. ;
Winter, R. E. ;
Keightley, P. T. ;
Kim, W. -K. ;
Falk, M. L. ;
Rigney, D. A. .
ACTA MATERIALIA, 2009, 57 (17) :5270-5282