Modelling of a microelectromechanical thermoelectric cooler

被引：64
作者：
Völklein, F
Min, G
Rowe, DM
机构：
[1] Univ Appl Sci Wiesbaden, Wiesbaden, Germany
[2] Univ Wales, Sch Engn, Cardiff, S Glam, Wales
来源：
SENSORS AND ACTUATORS A-PHYSICAL | 1999年 / 75卷 / 02期
关键词：
thermoelectric microcooler; modelling; microelectromechanical system; dew-point sensor;
D O I：
10.1016/S0924-4247(99)00002-3
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We represent the modelling of a thermoelectric cooler, which is designed by using micromachining and thin film technology. The cooler fabrication is compatible with standard semiconductor technology. Therefore, it can be integrated in microelectronic circuits. The most important parameters of the device like cooling power, maximum temperature difference and optimum current density are calculated. By using thermoelectric thin films with high efficiency and very thin SiC/Si3N4-membranes, a cooling power of a few milliWatts or maximum temperature difference of 30-50 K can be achieved. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码：95 / 101
页数：7
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