共 24 条
[1]
Impression creep behavior of a Cu-6Ni-2Mn-2Sn-2Al alloy
[J].
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,
2012, 535
:202-208
[2]
EFFECT OF GRAIN BOUNDARIES ON ELECTRICAL RESISTIVITY OF POLYCRYSTALLINE COPPER AND ALUMINIUM
[J].
PHILOSOPHICAL MAGAZINE,
1969, 19 (161)
:887-&
[3]
MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF CONCENTRATED COPPER NIOBIUM ALLOYS PREPARED BY MECHANICAL ALLOYING
[J].
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,
1993, 161 (02)
:255-266
[4]
Benson D.J., 2001, MAT SCI ENG A-STRUCT, V319-321, P864
[7]
Effect of solution treatment on precipitation behaviors and age hardening response of Al-Cu alloys with Sc addition
[J].
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,
2011, 530
:607-617
[8]
Chen S.C., 1999, PHYS PROPERTIES MAT
[9]
DeHoff R., 1968, QUANTITATIVE MICROSC
[10]
Formation of the microstructure in Cu-Nb alloys
[J].
JOURNAL OF MATERIALS SCIENCE,
2004, 39 (16-17)
:5343-5345