Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys

被引：25

作者：

Liu, Chih-Yao ^{[1
]}

Hon, Min-Hsiung ^{[1
,2
]}

Wang, Moo-Chin ^{[3
]}

Chen, Ying-Ru ^{[4
]}

Chang, Kuo-Ming ^{[4
]}

Li, Wang-Long ^{[4
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

[2] Natl Kaohsiung Univ Appl Sci, Dept Mech Engn, Kaohsiung 80782, Taiwan

[3] Kaohsiung Med Univ, Dept Fragrance & Cosmet Sci, Kaohsiung 80728, Taiwan

[4] Natl Cheng Kung Univ, Inst Nanotechnol & Microsyst Engn, Tainan 70101, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2014年 / 582卷

关键词：

Aging time; Microstructure; Lattice parameter; Grain size; Yield strength; PB-FREE SOLDER; ZN-BI SOLDERS; CU-SUBSTRATE; INTERMETALLIC COMPOUNDS; JOINT STRENGTH; MICROSTRUCTURE; NANOPARTICLES; INTERFACE; BEHAVIOR; GROWTH;

D O I：

10.1016/j.jallcom.2013.08.022

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The effects of aging time on the mechanical properties of the Sn-9Zn-1.5Ag-xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn-9Zn-1.5Ag-xBi solder alloys is composed of Sn-rich phase and AgZn3. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn-9Zn-1.5Ag solder alloys with various Bi contents before and after aging at 150 degrees C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 +/- 2.2 MPa for Sn-9Zn-1.5Ag-3Bi solder alloy before aging. (C) 2013 Elsevier B.V. All rights reserved.

引用

页码：229 / 235

页数：7

共 32 条

[1]

[Anonymous], 2003, OFFICIAL J EURO UNIO, V46, P24

[2] Study of atomic diffusion in crystalline structures by high-resolution X-ray diffraction [J].

Avrahami, Y ;

Shilo, D ;

Mainzer, N ;

Zolotoyabko, E .

JOURNAL OF CRYSTAL GROWTH, 1999, 198 :264-269

[3] Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate [J].

Chang, TC ;

Wang, MC ;

Hon, MH .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2005, 36A (11) :3019-3029

[4] Effect of aging on the growth of intermetallic compounds at the interface of Sn-9Zn-xAg/Cu substrates [J].

Chang, TC ;

Wang, MC ;

Hon, MH .

JOURNAL OF CRYSTAL GROWTH, 2003, 250 (1-2) :236-243

[5] Phase equilibria and solidification of ternary Sn-Bi-Ag alloys [J].

Chen, Sinn-wen ;

Wu, Hsin-jay ;

Huang, Yu-chih ;

Gierlotka, Wojciech .

JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 497 (1-2) :110-117

[6] ORDERING KINETICS IN LONG-RANGE ORDERED CU3AU [J].

FEDER, R ;

MOONEY, M ;

NOWICK, AS .

ACTA METALLURGICA, 1958, 6 (04) :266-277

[7] The mechanical behavior of interconnect materials for electronic packaging [J].

Frear, DR .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1996, 48 (05) :49-53

[8]

Gain A.K., 2009, 2009 EL COMP TECHN C, V26-29, P1021

[9] Joint strength and interfacial microstructure between Sn-Ag-Cu and Sn-Zn-Bi solders and Cu substrate [J].

Hirose, A ;

Yanagawa, H ;

Ide, E ;

Kobayashi, KF .

SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2004, 5 (1-2) :267-276

[10] Effect of misch metal on elevated temperature tensile ductility of the Cu-Zn-Bi alloy [J].

Jang, YH ;

Kim, SS ;

Han, SZ .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2005, 36A (04) :1060-1065

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