Experimental Investigation on Transient Process of A New-Type Heat-pipe Heat-sink

被引：0

作者：

Xie Xuliang ^{[1
]}

机构：

[1] Changan Univ, Sch Automobile, Xian 710064, Shaanxi, Peoples R China

来源：

ADVANCED MATERIALS AND COMPUTER SCIENCE, PTS 1-3 | 2011年 / 474-476卷

关键词：

heat pipe; heat sink; chip cooling; thermal performance; transient process; experimental investigation;

D O I：

10.4028/www.scientific.net/KEM.474-476.880

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

In order to verify whether a new kind heat pipe heat sink can meet the requirement of high energy chip cooling or not, an experiment was conducted under heating and cooling process with a constant airflow rate. The transient heat exchange rate and transient temperature response of four thermocouples mounted on the upwind surface of the heat sink condenser were obtained. Results show that heat resistance decreases with increase in heat transfer rate under heating process, and the heat resistance is about 0.22K/W with the airflow rate 40m(3)/h. The transient temperature response is also analyzed with theory.

引用

页码：880 / 882

页数：3