Rate-Limited Electroless Gold Thin Film Growth: A Real-Time Study

被引:7
|
作者
Jang, Gyoung Gug [1 ]
Blake, Phillip [1 ]
Roper, D. Keith [1 ]
机构
[1] Univ Arkansas, Ralph E Martin Dept Chem Engn, Bell Engn Ctr 3202, Fayetteville, AR 72701 USA
基金
美国国家科学基金会;
关键词
COPPER DEPOSITION; MICROSYSTEM APPLICATIONS; MASS-TRANSPORT; ELECTRODEPOSITION; FORMALDEHYDE; SURFACE; SILVER; NANOSTRUCTURES; SPECTROSCOPY; FABRICATION;
D O I
10.1021/la304154u
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Time-resolved, in situ spectroscopy of electroless (EL) gold (Au) films combined with electron microscopy showed that the deposition rate increased up to two-fold on surfaces swept by the bulk flow of adjacent fluid at Reynolds numbers less than 1.0, compared to batch immersion. Deposition rates from 5.0 to 9.0 nm/min and thicknesses of the EL Au film from 20 to 100 nm, respectively, increased predictably with flow rate at conditions when the deposition was limited primarily by Fickian diffusion. Time-frames were identified for metal island nucleation, growth, and subsequent film development during EL Au deposition by real-time UV-visible spectroscopy of photoluminescence (PL) and surface plasmon features of nanoscale metal deposits. Film thicknesses measured by scanning electron microscopy and X-ray photoelectron spectroscopy paired with real-time optical spectroscopy of kinetic aspects of plasmon and PL optical features indicated that Au film deposition on surfaces swept by a steady flow of adjacent fluid can be primarily diffusion limited.
引用
收藏
页码:5476 / 5486
页数:11
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