Parallel micro component-to-substrate assembly with controlled poses and high surface coverage

被引:43
作者
Fang, J [1 ]
Böhringer, KF [1 ]
机构
[1] Univ Washington, Dept Elect Engn, Seattle, WA 98195 USA
关键词
D O I
10.1088/0960-1317/16/4/008
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate a novel parallel micro assembly process based on both shape recognition and capillary-driven self-assembly in an air environment. Mechanically diced 790 mu m square silicon parts with flat or step edges were used for proof-of-concept demonstrations. Each part had only one hydrophobic 790 mu m x 790 mu m face and its other faces were hydrophilic. On a vibrating plate, tumbling parts were captured by cavities having an opening clearance that only admitted a single part standing vertically. The trapped parts were then transferred to a substrate having an array of receptor sites covered with water droplets. The flat-edge parts attached vertically to these sites and then capillary forces from water condensate turned them to face the substrate with their 790 mu m x 790 mu m hydrophilic faces. The step-edge parts attached at a tilted angle due to their featured edges and then a pressing plate laid them down. This process assembled micro parts to 1000 densely packed receptor sites in about 2 min with a defect rate of similar to 1%. A single batch assembly process achieved 31% surface coverage, and a second batch doubled the ratio to 62%.
引用
收藏
页码:721 / 730
页数:10
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