Microstructural evolution in adiabatic shear bands of copper at high strain rates: Electron backscatter diffraction characterization

被引：39

作者：

Tang, Lin ^{[1
]}

Chen, Zhiyong ^{[1
]}

Zhan, Congkun ^{[1
]}

Yang, Xuyue ^{[1
]}

Liu, Chuming ^{[1
]}

Cai, Hongnian ^{[2
]}

机构：

[1] Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China

[2] Beijing Inst Technol, Sch Mat Sci & Engn, Beijing 100081, Peoples R China

来源：

MATERIALS CHARACTERIZATION | 2012年 / 64卷

基金：

中国国家自然科学基金;

关键词：

Copper; High strain rate; Adiabatic shear band; Electron backscatter diffraction; Dynamic recrystallization; BALLISTIC PLUG FORMATION; DYNAMIC RECRYSTALLIZATION; TI-6AL-4V TARGETS; DEFORMATION; LOCALIZATION; TANTALUM; IMPACT; STEEL; ALLOY;

D O I：

10.1016/j.matchar.2011.11.011

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The microstructural evolution of adiabatic shear bands in annealed copper with different large strains at high strain rates has been investigated by electron backscatter diffraction. The results show that mechanical twinning can occur with minimal contribution to shear localization under dynamic loading. Elongated ultrafine grains with widths of 100-300 nm are observed during the evolution of the adiabatic shear bands. A rotational dynamic recrystallization mechanism is proposed to explain the formation of the elongated ultrafine grains. (C) 2011 Elsevier Inc. All rights reserved.

引用

页码：21 / 26

页数：6

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