Propagation of the SiO2 breakdown event on MOS structures observed with conductive atomic force microscopy

被引:17
|
作者
Porti, M [1 ]
Nafría, M
Aymerich, X
Olbrich, A
Ebersberger, B
机构
[1] Univ Autonoma Barcelona, Dept Engn Elect, E-08193 Bellaterra, Spain
[2] Infineon Technol AG, D-81730 Munich, Germany
关键词
dielectric breakdown; breakdown propagation; SiO2; film; conductive atomic force microscope;
D O I
10.1016/S0167-9317(01)00608-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, for the first time, a conductive atomic force microscope has been used to electrically characterize the degradation and breakdown propagation of stressed ultra-thin (<6 nm) SiO2 films at a nanometric scale. The results show that, although a slight lateral propagation of the degradation is observed before breakdown, the affected area (few hundreds of nm(2)) remains relatively constant. However, breakdown is laterally propagated to neighbor spots, although only in some occasions morphological changes are observed. The breakdown affected area (several thousands of nm(2)) has been found to be strongly related to the hardness of the breakdown event. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:265 / 269
页数:5
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