Implementation of an in-situ particle monitoring methodology in a production environment

被引:2
作者
Khawaja, Y
Felker, S
Desanti, T
机构
来源
1996 ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - ASMC 96 PROCEEDINGS: THEME - INNOVATIVE APPROACHES TO GROWTH IN THE SEMICONDUCTOR INDUSTRY | 1996年
关键词
D O I
10.1109/ASMC.1996.558021
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The time and logistics associated with particle testing on product have driven manufacturing to find fast and effective monitoring techniques that can deliver high manufacturing efficiency at a lower cost. In-situ particle monitoring is an accurate and cost effective method of contamination control in a production environment. In-situ particle monitors use laser particle counters to sample particles exiting the chamber, the data is displayed in real-time enabling the user to respond immediately to any out of control conditions. Implementation of in-situ particle monitoring on a chemical downstream etch system in a production environment is described. The chamber clean cycles on this etch system are driven by polymer flaking from chamber parts, which makes real time particulate monitoring necessary. In- situ plasma clean process is characterized using insitu particle monitors to reduce particulate flaking from chamber parts. All process steps during the etch step are also analyzed using in-situ monitors to identify and eliminate sources of particulate contamination. Implementation of in-situ monitoring resulted in a 92% reduction in test wafer costs, and also provided a model for predicting particulate perturbations in the etch system. Improvements in cleaning techniques resulted in a two fold improvement in the mean time between cleans.
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页码:281 / 291
页数:11
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