共 21 条
- [1] Compact thermal models of packages used in conduction cooled applications [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (03): : 470 - 480
- [2] BOSCH EGT, 2001, P 7 THERMINIC WORKSH, P191
- [3] Christiaens F, 1998, IEEE T COMPON PACK A, V21, P565, DOI 10.1109/95.740047
- [4] CODECASA L, 1999, EUR C CIRC THEOR DES, P563
- [5] DJADOENATH S, 2000, P 6 THERMINIC WORKSH, P217
- [6] DRIESSENS E, 2000, P 6 THERMINIC WORKSH, P205
- [7] LASANCE C, 1995, P IEEE SEMICOND THER, P1, DOI 10.1109/STHERM.1995.512044
- [8] Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software [J]. FIFTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 1999, : 189 - 200
- [9] LASANCE CJM, 2000, P 6 THERMINIC WORKSH, P235
- [10] NEVELSTEEN K, 2000, P 6 THERMINIC WORKSH, P177