Influence of deposition parameters and kinetics of electroless Ni-P plating on polyester fiber

被引:18
作者
Guo, R. H. [2 ]
Jiang, S. X. [1 ]
Yuen, C. W. M. [1 ]
Ng, M. C. F. [1 ]
Lan, J. W. [2 ]
Zheng, G. H. [3 ]
机构
[1] Hong Kong Polytech Univ, Inst Text & Clothing, Kowloon, Hong Kong, Peoples R China
[2] Sichuan Univ, Coll Light Ind Text & Food Engn, Chengdu 610064, Peoples R China
[3] Chengdu Text Coll, Chengdu, Sichuan, Peoples R China
关键词
Electroless Ni-P plating; Polyester fiber; Deposition parameter; Kinetics; INTERFERENCE SHIELDING EFFECTIVENESS; TEXTILES; FABRICS;
D O I
10.1007/s12221-012-1037-4
中图分类号
TB3 [工程材料学]; TS1 [纺织工业、染整工业];
学科分类号
0805 ; 080502 ; 0821 ;
摘要
The electroless nickel-phosphorous (Ni-P) plating on polyester fiber using sodium hypophosphite as a reducing agent in alkaline medium was studied. The effects of plating parameters including concentrations, pH and bath temperature of the plating bath on deposition rate of the electroless Ni-P plating were investigated. The results reveal that the deposition rates increase with the increase in the concentration of nickel sulfate, sodium hypophosphite, pH and bath temperature, respectively. However, it is determined that the deposition rates decrease with the rise of sodium citrate. The kinetics of the deposition reaction was investigated and an empirical rate equation for electroless Ni-P plating on polyester fiber was developed.
引用
收藏
页码:1037 / 1043
页数:7
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