Direct welding between copper and glass substrates with femtosecond laser pulses

被引：95

作者：

Ozeki, Yasuyuki ^{[1
]}

Inoue, Tomoyuki ^{[1
]}

Tamaki, Takayuki ^{[1
,2
]}

Yamaguchi, Hideaki ^{[1
]}

Onda, Satoshi ^{[1
]}

Watanabe, Wataru ^{[3
]}

Sano, Tomokazu ^{[4
]}

Nishiuchi, Shumpei ^{[4
]}

Hirose, Akio ^{[4
]}

Itoh, Kazuyoshi ^{[1
]}

机构：

[1] Osaka Univ, Grad Sch Engn, Dept Mat & Life Sci, Suita, Osaka 5650871, Japan

[2] Nara Natl Coll Technol, Dept Control Engn, Nara 6391080, Japan

[3] Natl Inst Adv Ind Sci & Technol, Photon Res Inst, Osaka 5638577, Japan

[4] Osaka Univ, Grad Sch Engn, Div Mat & Mfg Sci, Suita, Osaka 5650871, Japan

来源：

APPLIED PHYSICS EXPRESS | 2008年 / 1卷 / 08期

关键词：

Laser pulses - Femtosecond lasers - Glass - Glass substrates - Copper - Scanning electron microscopy;

D O I：

10.1143/APEX.1.082601

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We demonstrate direct microwelding between glass and copper substrates by use of femtosecond (fs) pulses. The joint strength is as high as > 16MPa. A scanning electron microscopy cross-sectional image of the sample proves successful joining without voids or cracks. Furthermore, we show that, compared with ns-pulses, the use of fs-pulses can reduce the pulse energy required for welding by two orders of magnitude, leading to the suppressed effect of heat and to the precise control of the welded region. (C) 2008 The Japan Society of Applied Physics.

引用

页码：0826011 / 0826013

页数：3

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