Low-temperature hollow cathode plasma-assisted atomic layer deposition of crystalline III-nitride thin films and nanostructures

被引:11
|
作者
Ozgit-Akgun, Cagla [1 ,2 ]
Goldenberg, Eda [2 ]
Bolat, Sami [2 ,3 ]
Tekcan, Burak [2 ,3 ]
Kayaci, Fatma [1 ,2 ]
Uyar, Tamer [1 ,2 ]
Okyay, Ali Kemal [1 ,2 ,3 ]
Biyikli, Necmi [1 ,2 ]
机构
[1] Bilkent Univ, Inst Mat Sci & Nanotechnol, TR-06800 Ankara, Turkey
[2] Bilkent Univ, UNAM Natl Nanotechnol Res Ctr, TR-06800 Ankara, Turkey
[3] Bilkent Univ, Dept Elect & Elect Engn, TR-06800 Ankara, Turkey
关键词
AlN; GaN; InN; atomic layer deposition (ALD); hollow cathode plasma; ALN; AMMONIA; GROWTH; INN; GAN;
D O I
10.1002/pssc.201400167
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
Hollow cathode plasma-assisted atomic layer deposition (HCPA-ALD) is a promising technique for obtaining III-nitride thin films with low impurity concentrations at low temperatures. Here we report our previous and current efforts on the development of HCPA-ALD processes for III-nitrides together with the properties of resulting thin films and nanostructures. The content further includes nylon 6,6-GaN core-shell nanofibers, proof-of-concept thin film transistors and UV photodetectors fabricated using HCPA-ALD-grown GaN layers, as well as InN thin films deposited by HCPA-ALD using cyclopentadienyl indium and trimethylindium precursors. (c) 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
引用
收藏
页码:394 / 398
页数:5
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