Applications of Low Temperature Sintering Technology as Die Attach for High Temperature Power Modules

被引：0

作者：

Wu, Yibo ^{[1
]}

Zhao, Yimin ^{[1
]}

Wang, Yangang ^{[1
]}

Jones, Steve ^{[1
]}

Dai, Xiaoping ^{[1
]}

Liu, Guoyou ^{[1
]}

机构：

[1] Zhuzhou CSR Times Elect Co Ltd, Dynex Semicond Ltd, Power Semicond R&D Ctr, Lincoln LN6 3LF, England

来源：

2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年

关键词：

Low temperature sintering technology (LTST); silver sintering; die attach; DBC substrate; power module; high temperature; SILVER; SUBSTRATE;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silver-based low temperature sintering technology (LTST) is becoming a promising alternative to bond or joint the large area joints as die attach for high temperature power modules. A review of the silver-sintered die attach technologies will be presented in this paper, as well as a roadmap of challenge of the state-of-the-art silver sintering. Then, highlighted are the methodology of sintering process, the different types and application of sintered Ag paste, the effects of the process parameters on the sintering layer, and the quality evaluations of sintered joints by means of destructive or non-destructive tests. Finally, the applications as well as challenges of silver sintering for high temperature power modules are proposed.

引用

页码：452 / 457

页数：6

共 39 条

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