Peltier cooling in current-perpendicular-to-plane metallic junctions

被引：12
作者：
Fukushima, A
Kubota, H
Yamamoto, A
Suzuki, Y
Yuasa, S
机构：
[1] Natl Inst Adv Ind Sci & Technol AIST, Tsukuba, Ibaraki 3058568, Japan
[2] Osaka Univ, Grad Sch Engn Sci, Osaka 5608531, Japan
来源：
JOURNAL OF APPLIED PHYSICS | 2006年 / 99卷 / 08期
关键词：
D O I：
10.1063/1.2172211
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
Peltier cooling in submicron-sized current-perpendicular-to-plane metallic junctions (CPP-MJs) and enhancement of the Peltier coefficients are reported. The main goal of this study was to measure the temperature dependence of the Peltier coefficient. We fabricated submicron-sized CPP-MJs with Co/Au and Cr/Au interfaces. The obtained Peltier coefficients for the Co/Au and Cr/Au interfaces had opposite signs, and the magnitudes of both decreased as temperature decreased. A bridge type CPP-MJ having a Ti island connecting Co and Cr pillars was fabricated as a model of an electronic element. It also had a decrement of resistance with current. This indicates that Peltier cooling is effective to control the temperature of an electronic device such as a hard-disk head. (C) 2006 American Institute of Physics.
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页数：3
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