Linear microvibromotor for positioning optical components

被引:77
作者
Daneman, MJ
Tien, NC
Solgaard, O
Pisano, AP
Lau, KY
Muller, RS
机构
[1] Dept. of Elec. Eng. and Comp. Sci., University of California at Berkeley, Berkeley
[2] University of Texas, Austin, TX
[3] University of California, Berkeley, CA
[4] University of Illinois, Urbana-Champaign, IL
[5] University of California, San Diego, CA
[6] Dept. of Elec. Eng. and Comp. Sci., University of California, Berkeley, CA
[7] Silicon Proc. Devmt. Engineer P., Cambridge, MA
[8] Stanford University, Stanford, CA
[9] Dept. of Elec. and Comp. Eng., University of California, Davis, CA
[10] Columbia University, New York, NY
[11] Department of Mechanical Engineering, University of California, Berkeley, CA
[12] Mechanical Engineering Sciences Area, Xerox Palo Alto Research Center, CA
[13] California Institute of Technology, Pasadena, CA
[14] Ortel Corp., General Instrument Corp., IBM
[15] Stevens Institute of Technology, Hoboken, NJ
关键词
D O I
10.1109/84.536622
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report an electrostatically driven linear microvibromotor fabricated using surface-micromachining technology. This device is developed for use in actuated micro-optical systems on silicon. Its submicron positioning resolution and a travel range of over 350 mu m are excellent properties for this application. Vibromotor precision and velocity are characterized, and various drive methods are discussed. A simulation of the vibromotor dynamics is presented to explore optimization and control issues for this device.
引用
收藏
页码:159 / 165
页数:7
相关论文
共 10 条
[1]  
CHO YH, J MICROELECTROMECH S, V3, P81
[2]   SURFACE MICROMACHINING FOR MICROSENSORS AND MICROACTUATORS [J].
HOWE, RT .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1988, 6 (06) :1809-1813
[3]  
LEE AP, 1993, P 7 INT C SOL STAT S, P46
[4]  
Mulhern G. T., 1993, P 7 INT C SOL STAT S, P296
[5]  
RAGULSKIS K, 1988, VIBROMOTORS PRECISIO, P289
[6]  
ROARK RJ, 1989, FORMULAS STRESS STRA, P646
[7]  
Sashida T., 1993, Introduction to Ultrasonic Motors
[8]   OPTOELECTRONIC PACKAGING USING SILICON SURFACE-MICROMACHINED ALIGNMENT MIRRORS [J].
SOLGAARD, O ;
DANEMAN, M ;
TIEN, NC ;
FRIEDBERGER, A ;
MULLER, RS ;
LAU, KY .
IEEE PHOTONICS TECHNOLOGY LETTERS, 1995, 7 (01) :41-43
[9]   ELECTROSTATIC-COMB DRIVE OF LATERAL POLYSILICON RESONATORS [J].
TANG, WC ;
NGUYEN, TCH ;
JUDY, MW ;
HOWE, RT .
SENSORS AND ACTUATORS A-PHYSICAL, 1990, 21 (1-3) :328-331
[10]  
TIEN NC, 1994 IEDM