3D Printing and the Future (or Demise) of Intellectual Property

被引:3
|
作者
Hornick, John F. [1 ]
机构
[1] Finnegan, 901 New York Ave NW, Washington, DC 20001 USA
关键词
D O I
10.1089/3dp.2013.0005
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:34 / 43
页数:10
相关论文
共 50 条
  • [1] 3D Printing and Intellectual Property
    不详
    JOURNAL OF PRINT AND MEDIA TECHNOLOGY RESEARCH, 2020, 9 (02): : 120 - 120
  • [2] Intellectual property and 3D printing: a case study on 3D chocolate printing
    Li, Phoebe
    Mellor, Stephen
    Griffin, James
    Waelde, Charlotte
    Hao, Liang
    Everson, Richard
    JOURNAL OF INTELLECTUAL PROPERTY LAW & PRACTICE, 2014, 9 (04) : 322 - 332
  • [3] 3D Printing and Beyond: Intellectual Property and Regulation
    Thomas, Sean
    INTERNATIONAL JOURNAL OF LAW AND INFORMATION TECHNOLOGY, 2020, 28 (02): : 185 - 188
  • [4] 3D Printing, Intellectual Property and Innovation Policy
    Bechtold S.
    IIC - International Review of Intellectual Property and Competition Law, 2016, 47 (5) : 517 - 536
  • [5] Reevaluating intellectual property law in a 3D printing era
    Osborn, Lucas S., 1600, National Academy of Sciences (47):
  • [6] Intellectual Property Infringements & 3D Printing: Decentralized Piracy
    Depoorter, Ben
    HASTINGS LAW JOURNAL, 2014, 65 (06) : 1483 - 1503
  • [7] Applicability of Watermarking for Intellectual Property Rights Protection in a 3D Printing Scenario
    Macq, Benoit
    Alface, Patrice Rondao
    Montanola, Mireia
    WEB3D 2015, 2015, : 89 - 95
  • [8] 3D printing the future
    Chapman, Kit
    Chemistry World, 2020, 17 (03): : 50 - 53
  • [9] 3D Printing, Intellectual Property Rights and Medical Emergencies: In Search of New Flexibilities
    Rosa Maria Ballardini
    Marc Mimler
    Timo Minssen
    Mika Salmi
    IIC - International Review of Intellectual Property and Competition Law, 2022, 53 : 1149 - 1173
  • [10] The Influence of Blockchain on Intellectual Property Pledge Financing Decisions in 3D Printing Technology
    Deng, Liurui
    Li, Shaodan
    Zhu, Yuntao
    IEEE ACCESS, 2025, 13 : 41797 - 41821