共 50 条
- [21] In-line Testing of Blind TSVs for 3D IC Integration and M/NEMS Packaging 2013 8TH ANNUAL IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (IEEE NEMS 2013), 2013, : 233 - 236
- [22] Thermal Evaluation and Analyses of 3D IC Integration SiP with TSVs for Network System Applications 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1866 - 1873
- [23] 3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding 2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, 2009, : 331 - 334
- [24] Low Temperature Cu/In Bonding for 3D Integration 2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2017, : 17 - 17
- [25] Full Characterization of Cu/Cu Direct Bonding for 3D Integration 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 219 - 225
- [26] Non-Conductive Film Underfill for 3D Integration of 20 μm-Thick LSI Wafers with Fine Cu-TSVs 2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2016, : 466 - 471
- [27] Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process OPTICS EXPRESS, 2012, 20 (05): : 5011 - 5016
- [29] Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 361 - 366
- [30] Electrical Characterization of Through Silicon Vias (TSVs) with an On Chip Bus Driver for 3D IC Integration 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 851 - 856