Performance of 9.0 W light-emitting diode on various layers of magnesium oxide thin film thermal interface material

被引:10
作者
Idris, Muhammad Sani [1 ,2 ]
Subramani, Shanmugan [1 ]
机构
[1] Univ Sains Malaysia USM, Sch Phys, George Town 11800, Malaysia
[2] Fed Coll Educ, Dept Phys, Kano, Nigeria
来源
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2020年 / 126卷 / 08期
关键词
Lighting technology; Miniaturization of package; Uniformity in MgO film coating; Reliability; High efficiency; ELECTRICAL-PROPERTIES;
D O I
10.1007/s00339-020-03820-y
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
MgO thin films were spin coated on aluminum (Al) substrate and used between LED package and heat sink as thin-film heat spreader. Crystallographic studies showed the presence of (111), (200) and (220) orientations related to MgO phases. From the XRD analysis, 10-layers of MgO showed a favorable film thickness (424 nm), crystal size (11.6 nm), microstrain (0.4860 nm) and dislocation density (0.0078 lines/m(2)). Similarly, low surface roughness (14.6 nm) and depth of peak-valley (71.6 nm) were recorded from 10-layers MgO thin film using Atomic Force Microscopy (AFM) analysis. Relative thermal conductivity of 22.93 W/mK was recorded from the 10-layers MgO film. High value of the difference in total thermal resistance (Delta Rth-tot = 3.01 K/W) and rise in junction temperature (Delta T-J = 18.92 degrees C) were recorded along with good thermal impedance (35 degrees C) from the 10-layers MgO thin film measured at 700 mA using thermal transient analysis. Overall, MgO thin film coated Al substrates showed an improved performance for the tested LED and, therefore, can be considered as an alternative thermal substrate for LED thermal management.
引用
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页数:13
相关论文
共 31 条
[1]   Study on thermal performance of high power LED employing aluminum filled epoxy composite as thermal interface material [J].
Anithambigai, P. ;
Shanmugan, S. ;
Mutharasu, D. ;
Zahner, T. ;
Lacey, D. .
MICROELECTRONICS JOURNAL, 2014, 45 (12) :1726-1733
[2]  
[Anonymous], 2015, THESIS
[3]   Estimation of lattice strain in ZnO nanoparticles: X-ray peak profile analysis [J].
Bindu, P. ;
Thomas, Sabu .
JOURNAL OF THEORETICAL AND APPLIED PHYSICS, 2014, 8 (04) :123-134
[4]  
binti Aida, 2019, AIMS MAT SCI, V5, P246
[5]  
Bunyan MH, 2000, U.S. Patent, Patent No. [6,054,198, 6054198]
[6]   Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance [J].
Cao, Xiao ;
Wang, Tao ;
Ngo, Khai D. T. ;
Lu, Guo-Quan .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (04) :495-501
[7]   Relative importance of grain boundaries and size effects in thermal conductivity of nanocrystalline materials [J].
Dong, Huicong ;
Wen, Bin ;
Melnik, Roderick .
SCIENTIFIC REPORTS, 2014, 4 :7037
[8]  
Ejidio E, 2005, IEEE T COMPON PACK T, V28, P102
[9]  
Evans TC., 2014, (12) Patent Application Publication (10), Patent No. [2006/0222585, 20060222585]
[10]  
EzhilRaj AM, 2019, CRYST RES TECHNOL, V42, P867