Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules

被引：49

作者：

Zhang, Yuming ^{[1
,2
]}

Zhu, Honglai ^{[3
]}

Fujiwara, Masami ^{[4
]}

Xu, Jinquan ^{[1
]}

Dao, Ming ^{[2
]}

机构：

[1] Shanghai Jiao Tong Univ, Dept Engn Mech, Shanghai 200240, Peoples R China

[2] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA

[3] Beijing Inst Control Engn, Beijing 100190, Peoples R China

[4] Nihon Univ, Coll Engn, Div Appl Phys, Fukushima 9638642, Japan

来源：

SCRIPTA MATERIALIA | 2013年 / 68卷 / 08期

基金：

中国国家自然科学基金;

关键词：

Solder alloy; Low-temperature creep; Constitutive law; Fatigue; Lead-free solder; SOLID-SOLUTION ALLOY; BEHAVIOR; STRESS;

D O I：

10.1016/j.scriptamat.2012.12.017

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Creep tests covering a broad temperature range (-40 to 120 degrees C) were systematically performed on Pb5Sn and Sn3Ag0.5Cu solder alloys. Experimental results showed that both solder alloys creep significantly within the temperatures and stress levels tested. A single set of constitutive equations was constructed to describe creep deformation over a wide range of stress and temperature. Numerical analyses revealed that, when evaluating creep failure, significant errors may result from ignoring creep at low temperatures, especially for the lead-free solder alloy Sn3Ag0.5Cu. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：607 / 610

页数：4

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