Investigation of lightpipe volumetric radiation effects in RTP thermometry

被引:9
作者
Frankman, DJ [1 ]
Webb, BW [1 ]
Jones, MR [1 ]
机构
[1] Brigham Young Univ, Dept Mech Engn, Provo, UT 84602 USA
来源
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 2006年 / 128卷 / 02期
关键词
D O I
10.1115/1.2136917
中图分类号
O414.1 [热力学];
学科分类号
摘要
A major obstacle to the widespread implementation of rapid thermal processing (RTP) is the challenge of wafer temperature measurement. Frequently, lightpipe radiation thermometers are used to measure wafer temperatures in RTP reactors. While the lightpipe distorts the wafer temperature profile less than temperature measurement techniques which require physical contact, the presence of the lightpipe influences the wafer temperature profile. This paper presents the results of a theoretical study exploring that influence for an idealized RTP reactor in which the wafer is treated as a nonconducting, opaque, constant-heat-flux surface imaged by the lightpipe. The coupled radiation/ conduction transport in the lightpipe measurement enclosure is solved numerically. Radiation transfer in the system is modeled with varying levels of rigor ranging from a simple volumetrically nonparticipating treatment to a full spectral solution of the radiative transfer equation. The results reveal a rather significant effect of the lightpipe on the wafer temperature, which depends on the separation between the lightpipe tip and the wafer. The study illustrates clearly the need to model the lightpipe as a volumetrically participating, semitransparent medium, and further the importance of accounting for spectral variation of the lightpipe properties in the prediction of the radiative transfer Finally, two primary mechanisms are identified by which the lightpipe affects the wafer temperature distribution.
引用
收藏
页码:132 / 141
页数:10
相关论文
共 13 条
[1]  
[Anonymous], 1980, SERIES COMPUTATIONAL, DOI [DOI 10.1201/9781482234213, 10.1201/9781482234213]
[2]   Modeling and experimental results for an RTP light-pipe radiation thermometer calibration testbed [J].
Ball, KS ;
Howell, JR .
RTP 2004: 12TH IEEE INTERNATIONAL CONFERENCE ON ADVANCED THERMAL PROCESSING OF SEMICONDUCTORS : RTP 2004, 2004, :175-180
[3]   The UT/NIST/SA/ISMT thermometry test bed-2001 [J].
Ball, KS ;
Huston, KS ;
Noska, BL ;
Simonich, MA ;
Geyling, FT ;
Sing, D ;
Tichy, RS ;
Baharav, Y .
9TH INTERNATIONAL CONFERENCE ON ADVANCED THERMAL PROCESSING OF SEMICONDUCTORS - RTP 2001, 2001, :149-162
[4]  
Brewster MQ., 1992, Thermal Radiative Transfer and Properties
[5]  
Cebeci T, 1974, P 5 INT HEAT TRANSF, V3, P15
[6]   COMPUTATION OF RADIANT-HEAT TRANSFER ON A NONORTHOGONAL MESH USING THE FINITE-VOLUME METHOD [J].
CHUI, EH ;
RAITHBY, GD .
NUMERICAL HEAT TRANSFER PART B-FUNDAMENTALS, 1993, 23 (03) :269-288
[7]  
FAIR RB, 1993, RAPID THERMAL PROCES, P1
[8]  
GAMBA M, 2002, P IMECE2002 ASME INT
[9]   Lightpipe proximity effects on Si wafer temperature in rapid thermal processing tools [J].
Kreider, KG ;
Chen, DH ;
DeWitt, DP ;
Kimes, WA ;
Tsai, BK .
11TH IEEE INTERNATIONAL CONFERENCE ON ADVANCED THERMAL PROCESSING OF SEMICONDUCTORS, 2003, :125-129
[10]   LOCAL NONSIMILAR SOLUTIONS FOR NATURAL-CONVECTION ON A VERTICAL CYCLINDER [J].
MINKOWYCZ, WJ ;
SPARROW, EM .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1974, 96 (02) :178-183