Plasma Immersion Ion Implantation for SOI fabrication

被引:0
作者
Roth, IS [1 ]
Bryan, MA [1 ]
Liu, W [1 ]
Qin, S [1 ]
Lamm, AJ [1 ]
Chan, C [1 ]
机构
[1] Silicon Genesis Corp, Campbell, CA 95008 USA
来源
PROCEEDINGS OF THE NINTH INTERNATIONAL SYMPOSIUM ON SILICON-ON-INSULATOR TECHNOLOGY AND DEVICES | 1999年 / 99卷 / 03期
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D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
We have developed a process to produce high-quality, low-cost SOI wafers by layer transfer of a thin film. One of the steps of this process is hydrogen implantation, which can be cost-effectively performed by Plasma Immersion Ion Implantation (PIII). We have constructed a PIII system, and have used it to produce SOI wafers.
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页码:107 / 110
页数:4
相关论文
共 3 条
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  • [3] EN WG, 1998, UNPUB 1998 IEEE INT