Interfacial reaction and mechanical characterization of eutectic Sn-Zn/ENIG solder joints during reflow and aging

被引：10
作者：
Yoon, JW [1 ]
Chun, HS [1 ]
Jung, SB [1 ]
机构：
[1] Sungkyunkwan Univ, Dept Adv Mat Engn, Suwon 440746, Gyeonggi Do, South Korea
来源：
MATERIALS TRANSACTIONS | 2005年 / 46卷 / 11期
关键词：
lead free solder; tin-zinc solder; interfacial reaction; electroless nickel-immersion gold; ball shear test;
D O I：
10.2320/matertrans.46.2386
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The interfacial reactions and joint reliabilities between Sn-9 mass%Zn solder and an electroless nickel-immersion gold (ENIG) plated Cu substrate were investigated during reflow and isothermal aging at temperatures between 343 and 423 K for aging times of up to 2400h. After reflowing and aging, the intermetallic compound (IMC) formed at the interface was found to be AuZn3. No Ni-containing reaction products, such as Ni-Zn. Ni-Sn and Ni3P, were observed to form at the interface. The interfacial microstructure and shear strength remained nearly unchanged, irrespective of the reflow time, and the fractures occurred in the solder matrix. In the ball shear tests conducted after aging treatment, the shear strength of the samples decreased during the initial 100h of aging and then remained constant with prolonged aging. The interfacial reaction between the Sn-Zn solder and the Ni-P plating layer was found to he suppressed by the formation of a layer-type Au-Zn IMC layer, resulting in the desirable interfacial reaction. Compared to the fast interfacial reaction between the Sn-9Zn solder and Cu substrate, the Sn-9Zn/ ENIG solder joint was considered to have a superior joint reliability.
引用
收藏
页码：2386 / 2393
页数：8
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