Electrostatic Capacitance Extraction for Carbon Nanotube Interconnects

被引：1
|
作者：
Parkash, Vidur [1 ]
Goel, Ashok K. [1 ]
机构：
[1] Michigan Technol Univ, Houghton, MI 49931 USA
来源：
2008 51ST MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1 AND 2 | 2008年
关键词：
D O I：
10.1109/MWSCAS.2008.4616929
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Carbon nanotubes are promising candidates for futuristic nanoelectronic applications due to their excellent properties. In this paper, we present a comprehensive modeling and calculation of electrostatic capacitances for various carbon nanotube systems that can be used to model interconnects in nanotechnology circuits. We provide results for single walled, multiwalled and bundles of single-walled carbon nanotubes as functions of the various design parameters. Numerical computations were performed using the method of moments in conjunction with a Green's function appropriate for the geometry of the interconnects.
引用
收藏
页码：834 / 837
页数：4
相关论文
共 50 条
  • [31] Carbon nanotube technologies for LSI via interconnects
    Awano, Yuji
    IEICE TRANSACTIONS ON ELECTRONICS, 2006, E89C (11): : 1499 - 1503
  • [32] Electromagnetic and Circuital Modeling of Carbon Nanotube Interconnects
    Maffucci, A.
    Miano, G.
    Villone, F.
    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1051 - +
  • [33] Temperature Effects on Crosstalk in Carbon Nanotube Interconnects
    Jia, Lei
    Yin, Wen-Yan
    APMC: 2008 ASIA PACIFIC MICROWAVE CONFERENCE (APMC 2008), VOLS 1-5, 2008, : 3172 - 3175
  • [34] Crosstalk analysis of carbon nanotube bundle interconnects
    School of Electronics Information Engineering, Tianjin Key Laboratory of Film Electronic and Communication Devices, Tianjin University of Technology, Tianjin, 300384, China
    不详
    Nanoscale Res. Lett., (1-5):
  • [35] A Paradigm of Carbon Nanotube Interconnects in Microelectronic Packaging
    Yangyang Sun
    Lingbo Zhu
    Hongjin Jiang
    Jiongxin Lu
    Wei Wang
    C.P. Wong
    Journal of Electronic Materials, 2008, 37 : 1691 - 1697
  • [36] Crosstalk analysis of carbon nanotube bundle interconnects
    Zhang, Kailiang
    Tian, Bo
    Zhu, Xiaosong
    Wang, Fang
    Wei, Jun
    NANOSCALE RESEARCH LETTERS, 2012, 7
  • [37] Parameterized SPICE Models of Carbon Nanotube Interconnects
    Gadjeva, Elissaveta
    Popova, Petya
    Hristov, Marin
    Angelov, George
    2016 39TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2016, : 361 - 366
  • [38] Carbon Nanotube/Conducting Polymer Addressable Interconnects
    Lee, S. W.
    Katz, D.
    Grebel, H.
    Lopez, D.
    Kornblit, A.
    2007 CONFERENCE ON LASERS & ELECTRO-OPTICS/QUANTUM ELECTRONICS AND LASER SCIENCE CONFERENCE (CLEO/QELS 2007), VOLS 1-5, 2007, : 1097 - +
  • [39] Crosstalk analysis of carbon nanotube bundle interconnects
    Kailiang Zhang
    Bo Tian
    Xiaosong Zhu
    Fang Wang
    Jun Wei
    Nanoscale Research Letters, 7
  • [40] Integration of Vertical Carbon Nanotube Bundles for Interconnects
    Chiodarelli, Nicolo
    Kellens, Kristof
    Cott, Daire J.
    Peys, Nick
    Arstila, Kai
    Heyns, Marc
    De Gendt, Stefan
    Groeseneken, Guido
    Vereecken, Philippe M.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (10) : K211 - K217
12345