Investigation of microstructure and chemical composition of Ni contacts to n-type 4H-SiC

被引:14
|
作者
Rogowski, Jacek [1 ]
Kubiak, Andrzej [2 ]
机构
[1] Tech Univ Lodz, Inst Gen & Ecol Chem, PL-90924 Lodz, Poland
[2] Tech Univ Lodz, Dept Semicond & Optoelect Devices, PL-90924 Lodz, Poland
来源
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2012年 / 177卷 / 15期
关键词
Silicon carbide; Ohmic contact; TOF-SIMS; OHMIC CONTACTS; NICKEL SILICIDE; FILM;
D O I
10.1016/j.mseb.2012.01.012
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Structure and chemical compositions of the interface layer obtained after nickel deposition on silicon carbide surface and subsequent annealing have been analyzed using time-of-flight secondary ion mass spectrometry (TOF-SIMS), X-ray diffraction (XRD) and Raman spectroscopy. Nickel silicide (Ni2Si) were characterized as the main product of reaction between nickel and silicon carbide after annealing at temperatures range 700-1000 degrees C. Raman spectroscopy and TOF-SIMS profiling results confirmed carbon precipitation within contact layer. Obtained results indicate graphitic form of carbon and its non-uniform distribution in the contact layer. Moreover, TOF-SIMS analysis showed modification of nitrogen distribution in the contact area upon Ni/SiC contact annealing. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:1318 / 1322
页数:5
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