Impact of strain on gate-induced floating body effect for partially depleted silicon-on-insulator p-type metal-oxide-semiconductor-field-effect-transistors

This work investigates impact of mechanical strain on gate-induced-floating-body-effect (GIFBE) for partially depleted silicon-on-insulator p-type metal-oxide-semiconductor field effect transistors (PD SOI p-MOSFETs). First part, the original mechanism of GIFBE on PD SOI p-MOSFETs is studied. The experimental results indicate that GIFBE causes a reduction in oxide electric field (E-ox), resulting in an underestimate of negative-bias temperature instability (NBTI) degradation. This can be attributed to the electrons tunneling from the process-induced partial n(+) poly gate and anode electron injection (AEI) model, rather than the electron valence band tunneling (EVB) widely accepted as the mechanism for n-MOSFETs. And then, the second part shows that the strained FB device has less NBTI degradation than the unstrained devices. This behavior can be attributed to the fact that more electron accumulation was induced by strain-induced band gap narrowing, reducing NBTI significantly. (c) 2012 Elsevier B.V. All rights reserved.