STRUCTURE EVOLUTION AND ELECTRIC PROPERTIES OF TaN FILMS DEPOSITED ON Al2O3-BASED CERAMIC AND GLASS SUBSTRATES BY MAGNETRON REACTIVE SPUTTERING

Structure evolution and electric properties of tantalum nitride (TaN) films deposited on Al2O3-based ceramic and glass substrates by magnetron reactive sputtering were carried out as a function of the N-2-to-Ar flow ratio. The TaN thin films on Al2O3-based ceramic substrates grow with micronclusters composed of numerous nanocrystallites, contains from single-phase of Ta2N grains to TaN, and exhibits high defect density, sheet resistance and negative TCR as the N-2-to-Ar flow ratio continuously increases. However, the films on the glass substrates grow in the way of sandwich close-stack, contains from single-phase of Ta2N grains to TaN and Ta3N5 phases with the increase of N-2-to-Ar flow ratio. These results indicate that the N-2-to-Ar flow ratio and surface characteristic difference of substrates play a dominant effect on the structure and composition of the TaN films, resulting in different electrical properties for the films on Al2O3-based ceramic and the samples on glass substrates.