Coarsening processes in the lead-free solder alloy AgCu:: Theoretical and experimental investigations

被引：0

作者：

Müller, WH ^{[1
]}

Böhme, T ^{[1
]}

机构：

[1] Tech Univ Berlin, Inst Mech, LKM, D-10587 Berlin, Germany

来源：

PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2 | 2005年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Experimental investigations show that the microstructure of solders changes over time. In order to estimate the reliability and the lifetime of microelectronic solder materials it is important to predict the rate of microstructural change. Starting with an experimentally based overview on nucleation, spinodal decomposition as well as subsequent phase growth as observed in (lead-free) microelectronic solder connections this paper concentrates on the mathematical description of these phenomena.

引用

页码：613 / 617

页数：5

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