Coarsening processes in the lead-free solder alloy AgCu:: Theoretical and experimental investigations

被引：0

作者：

Müller, WH ^{[1
]}

Böhme, T ^{[1
]}

机构：

[1] Tech Univ Berlin, Inst Mech, LKM, D-10587 Berlin, Germany

来源：

PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2 | 2005年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Experimental investigations show that the microstructure of solders changes over time. In order to estimate the reliability and the lifetime of microelectronic solder materials it is important to predict the rate of microstructural change. Starting with an experimentally based overview on nucleation, spinodal decomposition as well as subsequent phase growth as observed in (lead-free) microelectronic solder connections this paper concentrates on the mathematical description of these phenomena.

引用

页码：613 / 617

页数：5

共 50 条

[1] A Compliant Lead-Free Solder Alloy [J].

Sabri, Mohd Faizul Mohd ;

Shnawah, Dhafer Abdul-Ameer ;

Badruddin, Irfan Anjum ;

Said, Suhana Binti Mohd .

2012 10TH IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE), 2012, :453-457

[2] New lead-free solder alloy [J].

Kamal, M ;

Meikhail, MS ;

El-Bediwi, AB ;

Gouda, ES .

RADIATION EFFECTS AND DEFECTS IN SOLIDS, 2005, 160 (07) :301-312

[3] SUPPRESSION OF MICROSTRUCTURAL COARSENING AND CREEP DEFORMATION IN A LEAD-FREE SOLDER [J].

MCCORMACK, M ;

JIN, S ;

KAMMLOTT, GW .

APPLIED PHYSICS LETTERS, 1994, 64 (05) :580-582

[4] Theoretical and experimental investigations of microstructural changes in lead-free solders [J].

Boehme, Thomas ;

Mueller, Wolfgang H. .

COMPUTATIONAL MATERIALS SCIENCE, 2008, 43 (01) :221-228

[5] A study on the novel lead-free solder alloy [J].

Huang, L ;

Ma, JS ;

Chen, GH ;

Geng, ZT ;

Ning, HL .

PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, :1095-1097

[6] Nanowires of Lead-Free Solder Alloy SnCuAg [J].

Atalay, F. E. ;

Avsar, D. ;

Kaya, H. ;

Yagmur, V. ;

Atalay, S. ;

Seckin, T. .

JOURNAL OF NANOMATERIALS, 2011, 2011

[7] Advanced alloy for lead-free solder balls [J].

Dittes, M ;

Walter, H .

SOLDERING & SURFACE MOUNT TECHNOLOGY, 2003, 15 (01) :50-54

[8] The study on the novel lead-free solder alloy [J].

Huang, L ;

Wang, Q ;

Ma, JS .

PROCEEDINGS OF INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2000, :191-193

[9] Solder paste with polymerizing flux for lead-free solder alloy [J].

Nishina, T ;

Okamoto, K .

2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 :535-540

[10] Analysis of new lead-free solder alloy microstructure [J].

Geng Zhiting ;

Heqing ;

Cheng Guohai ;

Ma Jusheng .

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, :468-470

← 1 2 3 4 5 →