Effect of addition of Ce in Sn-30Zn solder on the structure and properties of the Mg/Al-brazed joint

被引：11

作者：

Liu, Liming ^{[1
]}

Zhang, Zhaodong ^{[1
]}

Liu, Fei ^{[1
]}

Wang, Zhi ^{[1
]}

Wang, Hongyang ^{[1
]}

机构：

[1] Dalian Univ Technol, Key Lab Liaoning Adv Welding & Joining Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE | 2013年 / 48卷 / 05期

基金：

国家杰出青年科学基金;

关键词：

MICROSTRUCTURE CHARACTERISTICS; MAGNESIUM ALLOY; GRAIN-REFINEMENT; ALUMINUM; WELDS; AZ31B; AL;

D O I：

10.1007/s10853-012-6972-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

AZ31B Mg alloy and 6061 Al alloy are joined using low-temperature soldering with Sn-30Zn-xCe solder alloy. The effect of Ce content in Sn-30Zn-xCe solders on microstructure evolution and mechanical properties of the different brazed joints are investigated. The experimental results show that adding appropriate amount of Ce into Sn-30Zn solder is conducive to decreasing the amount of Mg2Sn intermetallic compounds and increasing the amount of Al-Sn-Zn solid solutions in the soldering zone of the brazed joint, which restricts the drawback of the formation of hard and brittle Mg2Sn intermetallic compounds and enhances the mechanical property of soldered joint. The average shear strength of the Mg/Sn-30Zn-0.05Ce/Al-brazed joint can reach 77.48 MPa. Results also indicate that the excessive content of Ce leads to the formation of some Ce-Zn and Ce-Sn intermetallic compounds in soldering zone and subsequently decreases the strength of soldered joint.

引用

页码：2030 / 2037

页数：8

共 25 条

[1] Interface phenomena in aluminium-magnesium magnetic pulse welding [J].