Impact of Ring-Shaped Collector Contact on Total Ionizing Dose Susceptibility of Vertical n-p-n Bipolar Transistors

被引:1
作者
Wei, Jianan [1 ]
Zhang, Peijian [1 ]
Shui, Guohua [2 ]
Luo, Ting [1 ]
Chen, Xian [1 ]
Wu, Yunchen [1 ]
Hong, Min [1 ]
Tang, Xinyue [1 ]
Zhu, Kunfeng [2 ]
Zhang, Guangsheng [2 ]
Zhong, Yi [2 ]
Fu, Xiaojun [1 ]
Tan, Kaizhou [1 ]
Wu, Xue [3 ]
机构
[1] Sci & Technol Analog Integrated Circuit Lab, Chongqing 400060, Peoples R China
[2] Chongqing Semichip Elect Co Ltd, Chongqing 400060, Peoples R China
[3] Chongqing Giga Chip Technol Co Ltd, Chongqing 400060, Peoples R China
基金
中国国家自然科学基金;
关键词
Bipolar junction transistor (BJT); carrier recombination rate; ring-shaped collector contact (RCC); technology computer-aided design (TCAD) simulation; total ionizing dose (TID); SIMULATION; DEGRADATION; EMITTER; ELDRS;
D O I
10.1109/TNS.2022.3213042
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The impact of ring-shaped collector contact (RCC) on total ionizing dose (TID) susceptibility of 40-V vertical n-p-n bipolar transistors is investigated. The( 60)Co gamma-ray irradiation experiment shows that the devices with RCC suffer less current gain degradation than their counterparts with conventional collector contact structure, which is independent of the emitter area and bias condition during irradiation. Technology computer-aided design (TCAD) simulation results indicate that the enhancement in radiation tolerance of the RCC devices should be attributed to the mitigation of trap-assisted carrier recombination at the Si/SiO2 interfaces near emitter-base (EB) junction rather than the concentration or distribution variations of radiation-induced traps. Moreover, the mitigation of carrier recombination in RCC devices could result from the creation of new current flow paths that suppress the diffusion of injected electrons toward the trap-enriched Si/SiO2 interfaces.
引用
收藏
页码:2222 / 2228
页数:7
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