Research on the Issue of LED's Cooling Based on Heat Conduction Equations

被引：0

作者：

Huang, Zhiqin ^{[1
]}

Quan, Peiying ^{[1
]}

Pan, Yongqing ^{[1
]}

机构：

[1] Univ Jinan, Sch Math Sci, Jinan 250022, Peoples R China

来源：

SPORTS, ARTS MATERIALS AND MANAGEMENT SCIENCE | 2012年 / 507卷

关键词：

LED; Thermal substrate; Heat conduction equations; Comprehensive analysis;

D O I：

10.4028/www.scientific.net/AMR.507.137

中图分类号：

C93 [管理学]; O22 [运筹学];

学科分类号：

070105 ; 12 ; 1201 ; 1202 ; 120202 ;

摘要：

With the rapid development of power type LED, the issue of the cooling of LED has been prominent. How to make the heat generated by LED chip go out quickly in order to cool the LED chip has become an urgent problem. The form of heat goes through the substrate has been widely used and has become the best way to solve the heat problem. There are three types of LED substrate. They are metal substrate, ceramic substrate and composite substrate. At first, In this paper 1 analyze the theoretical of three-dimensional non-steady state and steady state heat conduction equation, then the three-dimensional model is simplified as one-dimensional model and I get the results of heat conduction equation under the one-dimensional stationary and non-steady state.

引用

页码：137 / 141

页数：5